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PCB Manufacturing by FairyTek
FairyTek is a leading provider of PCB fabrication services, serving customers in a variety of industries including consumer electronics, medical devices, automotive, and more. Our team of skilled professionals and advanced equipment allow us to handle PCB fabrication projects of any size and complexity.
Our PCB fabrication process includes the creation of the PCB design, as well as the production of the physical PCBs using advanced equipment and processes. We use high-quality materials and follow strict standards and specifications to ensure that our PCBs are reliable and functional.
To produce PCBs, we use a variety of specialized machines and equipment, including automatic optical inspection (AOI) machines, laser drilling machines, and surface mount technology (SMT) lines. These machines help us to produce high-quality PCBs with precise and consistent results.
In addition to our PCB fabrication services, we also offer a range of additional services such as component sourcing, assembly, testing and inspection, and packaging to ensure that our customers receive a complete and fully functional product.
No matter what your PCB fabrication needs are, FairyTek has the expertise and resources to help you succeed. Contact us today to learn more about how we can assist with your PCB fabrication project.
FairyTek PCB Samples
12-layer High Density Interconnector PCB
Regid-Flex PCB (FPC)
Flexible PCB
6-layer high-frequency high-speed PCB
Aluminum Base LED PCB
12-layer gold finger graphics card PCB
Step 1: PCB Raw Material Cutting
The raw material of a PCB is typically a thin sheet of copper-clad laminate, which consists of a layer of copper foil bonded to one or both sides of a non-conductive substrate material such as fiberglass or resin. In the cutting process, the raw PCB material is first marked with the outline of the individual PCBs using a laser cutter. The marked PCB panel is then placed on the cutting machine, and the machine follows the marked outline to cut the individual PCBs from the panel.
FairyTek has two main types of machines typically used in the cutting process of PCB fabrication: CNC routers and V-cut machines.
- CNC routers are computer-controlled machines that use a rotating cutting tool to cut through the PCB material. They are capable of producing precise and intricate cuts and are often used for cutting complex shapes and patterns.
- V-cut machines, on the other hand, use a diamond-tipped blade to score the PCB along a predetermined line, after which the PCB can be quickly snapped along the scored line.
V-cut machines are generally faster and more cost-effective than CNC routers, but are not as precise and are not suitable for cutting complex shapes.
After the cutting process, the individual PCBs are separated from the panel and are ready for the next stage of the manufacturing process.
Step 2: Photolithography
When your PCB design is ready for printing, FairyTek will use a plotter printer to create films from the circuit board design files. These films are like negatives of the schematic diagram and are used to create the actual PCB.
The inner layers of the PCB will be printed with black ink, representing the copper traces and circuits, and clear ink representing the non-conductive areas, such as the fiberglass base. The outer layer will have clear ink indicating the copper pathways and black ink showing where the copper will be etched away.
The films also have a registration hole for aligning the PCBs during the manufacturing process. They will be stored securely to prevent any damage. The films will then be used to transfer the pattern onto the PCB substrate using a series of chemical reactions and light exposure.
Step 3: Imaging
The Exposure machine transfers the pattern from the films onto the PCB substrate using light exposure and chemical reactions. The substrate is placed on a glass or metal plate, and the films are placed on top. The exposure machine then uses light to transfer the pattern onto the substrate.
The industry traditionally use UV (ultraviolet) lighting as imaging solution.It involves the use of a photoresist material, which is a light-sensitive material applied to the surface of the PCB. The photoresist is then exposed to UV light through a photomask, which has the desired pattern on it. The exposed areas of the photoresist are then removed, leaving behind the desired pattern on the PCB.
For multilayer PCB, FairyTek applies Laser direct imaging (LDI) as a method of patterning printed circuit boards using a laser to write the desired pattern onto a photoresist-coated PCB directly.
LDI has several advantages over traditional photolithography techniques, including the ability to create more complex patterns with higher resolution, faster processing times, and a reduced need for photomasks. It is also more environmentally friendly, as it does not require the use of chemicals and can be performed in a cleanroom environment. LDI is an essential tool in the PCB manufacturing process, allowing for the creation of high-quality, accurate, and reliable circuit boards.
Step 4: Layer Stackup (multilayer PCB)
Layer stackup refers to the arrangement and configuration of the different layers that make up the PCB. A typical layer stackup for a PCB includes the following layers:
- Surface Finish Layer: This layer is applied on top of the copper traces to protect them from oxidation and wear. There are several types of surface finishes available, including tin, silver, and gold plating, as well as various types of coatings.
- Solder Mask Layer: This layer is applied on top of the surface finish to protect the copper traces and provide insulation. It is typically green in color and is used to mask those parts of the PCB that should not be soldered.
- Copper Layer: This is the layer where the electrical traces are printed. The copper layer is usually made of thin sheets of copper that are laminated onto the substrate. Depending on the PCB design, there can be one or multiple copper layers in a stackup.
- Substrate Layer: This is the layer that provides structural support to the PCB. It is typically made of materials such as fiberglass or composite materials. The substrate also provides insulation and helps to distribute heat generated by the PCB.
- Prepreg Layer: This is a layer of uncured fiberglass impregnated with a thermosetting resin. It is used to bond together the copper and substrate layers.
- Core Layer: This is the base layer that provides additional structural support to the PCB. It is similar to the substrate layer, but is typically thicker.
The way the stackup is designed, like the distance between the layers, and the thickness of the layers can affect the signal integrity of the board, the amount of crosstalk, and the maximum operating frequency of the PCB.
Step 5: Hole Drilling
Hole drilling is a process used in the manufacturing of printed circuit boards (PCBs) to create the through-holes that are used to connect different layers of the board, as well as to mount components on the surface of the board. FairyTek uses several techniques in this step, including mechanical drilling, laser drilling, and chemical drilling.
- Mechanical drilling: Mechanical drilling is the most common method of hole drilling in PCBs. It involves the use of a high-speed drill bit that rotates at high speeds to cut through the PCB material. The drill bit is typically made of carbide or diamond and is guided by a drilling machine that moves the drill bit in the X, Y, and Z axes to create the desired hole pattern.
- Laser drilling: Laser drilling uses a high-powered laser to melt or vaporize the material of the PCB in order to create the holes. This method is typically used for drilling very small or precise holes, and it can also be used to drill through multiple layers of the PCB at once. Laser drilling is a highly precise method, but it can also be expensive and requires specialized equipment.
- Chemical drilling: Chemical drilling is a process that uses a chemical etchant to dissolve the PCB material and create the holes. This method is typically used when drilling very small or fine holes, and it can also be used to drill through multiple layers of the PCB at once. Chemical drilling is a precise method and does not generate heat-affected zone as compare to laser drilling but it is also dangerous and requires chemicals that need to be handled with care.
Once the holes are drilled, they typically need to be cleaned to remove any debris left behind by the drilling process. We use a variety of methods, such as blowing compressed air through the holes or using a brush or ultrasonic cleaner. Additionally, the edges of the holes may be deburred or chamfered to remove any sharp edges.
Step 6: Hole metallization and Plating
hole metallization refers to the process of filling vias and through-holes with a conductive material to provide an electrical connection between the different layers of the PCB. Plating forms the conductive pathways that connect the various components on the board.
A few methods are used in this process, including:
- Electroless plating: In the process, metal ions are reduced to metal atoms on the surface of the via or through-hole, depositing a layer of metal. This process is typically used for the uniform plating of large areas, such as the entire surface of a PCB.
- Electroplating: This process involves passing an electric current through a solution containing metal ions, which causes the metal ions to deposit onto the surface of the via or through-hole, forming a metal layer. This process is typically used for more precise plating, such as plating the edges of holes or plating specific areas of the PCB.
- Immersion plating: A process in which the PCB is immersed in a solution containing the metal to be plated. This process is typically used for thicker coatings and can be used in conjunction with electroplating or electroless plating to achieve the desired final thickness.
- Chemical Tinning: This method uses a chemical bath to deposit a tin layer in the via or through-holes. This process is usually considered a cheap and quick process and is widely used.
- Solder Filling: in this method, a solder paste is used to fill the hole by applying the paste using a screen printer, then reflowing the board to melt the paste and fill the hole with solder. This process is usually used in cases where the through-holes are large enough to handle the paste and the process.
Step 7: Outer layer plating, etching, AOI
The secondary plating process also referred to as pattern plating, is typically done following the dry film lamination process. In this step, additional dry film parts are plated. Before the graphic plating process can begin, the board surface must be prepared through various methods such as degreasing, micro-etching, and acid pickling. Due to the application of copper in the first plating process, a layer of tin is added to prevent the exposed copper from oxidizing and to protect the conductive material from being removed during outer layer etching.
The etching process begins by applying a photoresist material to the surface of the PCB. The photoresist is then exposed to UV light, which causes it to harden in areas where light is blocked by the circuit pattern. This creates a "negative" of the circuit pattern on the surface of the PCB.
The PCB is then placed in an etching solution, typically a mixture of ferric chloride and water, which removes the unhardened photoresist and the underlying copper in the areas where the photoresist was not hardened. This process is done in a controlled manner and time, to etch only desired area as per the circuit design.
During the outer layer AOI process, the PCB is illuminated with a bright light and then scanned by one or more cameras. The images captured by the cameras are then processed by the AOI software, which compares the images to a good board to identify any defects. The AOI system can also be configured to look for specific types of defects, such as missing or misaligned components, and can be programmed to ignore certain features, such as test points or fiducials.
Step 8: Solder mask and Silkscreen Apply
Solder mask and silkscreen printing are both surface treatment processes that are commonly used to protect and label the conductive pathways on the board.
- Solder mask, also known as solder resist, is a thin layer of insulating material that is applied to the surface of the PCB. It is typically made of a liquid photo-imageable polymer that is applied to the board and then hardened by exposure to ultraviolet (UV) light. The hardened polymer acts as a barrier to protect the conductive pathways from accidental contact with other components or from exposure to the environment. Solder mask is also used to provide insulation between the PCB and the components.
- Silkscreen printing, on the other hand, is a process that uses a stencil and ink to print labels, numbers, or other information onto the surface of the PCB. The stencil is a template that has the desired design or text cut out of it, and the ink is forced through the cutouts onto the surface of the PCB.
Solder mask can protect the PCB from the heat and force of soldering components and protect the components from short-circuit, silkscreen printing is used for identifying the PCB, for example, adding the company logo, board version, part number, etc.
Step 9: Surface Finish and Product Testing
At FairyTek, a large variety of surface finishes are offered which include: tin-lead hot air solder leveling (tin-lead HASL), lead-free HASL, organic solderability preservatives (OSP), immersion silver, immersion tin, electroless Nickel Immersion Gold (ENIG), hard gold, electroless nickel electroless palladium immersion gold (ENEPIG), etc.
Some PCB testing methods used in FairyTek include in-circuit testing, visual inspections, flying probe testing, automated optical inspection (AOI), functional testing, automated x-ray inspection, burn-in testing, and other more specific tests (depending on the board application).
Company Profile
【PCB&PCBA】FairyTek focus on PCBA & PCB since 2002, providing worldwide partners from 160 countries with one-stop service in PCB fields including PCB assembly, PCB fabrication, PCB clone&design, functional testing & programming, electric components sourcing, conformal coating, Enclosure assembly. We have 150+ stuff in an 8000㎡production base equipped with various of cutting-edge production machines, which ensure customers with high-quality services from 30+ industries including Consumer electronics, IOT&communication, medical devices, LED, automobile, industrial control, etc.
【Supply Chain】FairyTek has developed a rapid and efficient supply chain system and over 120 samples can be processed within 1 day. Averagely 100 million SMT points can be finished within each month. Our production process is ISO 9001:2015 and ISO13485:2016 certified.
【Service Comes First】FairyTek ‘s motto is service comes first. Our R&D team (23 stuff) offers 7/24 technical query services to help our customers solve problems. We try our best to meet customer requirements in time with high quality.